How to Choose Planar Molybdenum Sputtering Targets

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When choosing planar molybdenum sputtering targets, the key factors to consider are purity, grain size, and bonding methods. .

Purity is one of the most important factors when selecting planar molybdenum sputtering targets. High purity ensures consistent and reliable sputtering performance, as any impurities can lead to unwanted film defects. It is recommended to choose targets with a purity level of at least 99.95%.

Grain size also plays a crucial role in the sputtering process. Smaller grain sizes result in a more uniform film deposition, providing better coverage and adhesion. Therefore, it is advisable to choose targets with a fine grain size to achieve high-quality thin films.

In addition to purity and grain size, the bonding method used for attaching the target to the backing plate is another important consideration. There are various bonding methods available, including clamping, indium bonding, diffusion bonding, and elastomer bonding. Each method has its pros and cons, and the choice depends on factors such as target size, material properties, and desired deposition characteristics.

Ultimately, the selection of planar molybdenum sputtering targets is crucial for the success of the sputtering process and the quality of the thin films produced. By carefully considering factors such as purity, grain size, and bonding methods, researchers and manufacturers can ensure optimal sputtering performance and achieve their desired thin film properties.

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