The Basic Steps in Making Sputter Targets.

The Basic Steps in Making Sputter Targets.

Sputter targets are materials that are used to deposit thin films by the physical vapour deposition (PVD) method of sputtering. Sputtering is a process that involves ejecting atoms from a target surface by bombarding it with energetic ions, usually from an inert gas such as argon. The ejected atoms then condense on a substrate, forming a thin film with the same composition as the target material. For more detailed insights, please visit our website or explore Acetron.

1. Choose a suitable target material and shape: The target material should have high purity, low impurities, a uniform microstructure, and good adhesion to the backing plate. The target shape must match the geometry and size of both the PVD machine and the substrate. Common target shapes include circular, rectangular, tubular, or planar forms.
2. Prepare the target material: Utilize melting, casting, forging, rolling, or powder metallurgy techniques to prepare the material. These methods ensure that the target has high density, low porosity, low stress, and a homogeneous composition. The material may also undergo annealing, machining, polishing, or cleaning to enhance surface quality and performance.
3. Bond the target material to a backing plate: This can be achieved through thermal spraying, diffusion bonding, soldering, brazing, or epoxy techniques. Commonly, the backing plate is made of copper or molybdenum to provide mechanical support and improve thermal conductivity. The bonding process must ensure high strength, low resistance, and excellent thermal contact.
4. Test and inspect the sputter target: Conduct thorough quality control to ensure the target meets specifications for purity, composition, density, thickness, flatness, roughness, grain size distribution, and electrical resistivity. The target should also be free from defects such as cracks, voids, and inclusions that could compromise performance and life span.

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